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Device Processing Cleanroom

Pillar microcavity for single photon source
This facility provides an extensive range of equipment for the processing of III-V semiconductor material into devices for both electrical and optical measurements. This equipment includes:
  • Optical lithography for pattern formation in device structures to a resolution of around 1 micron.
  • Thermal evaporation for a wide range of materials for n-type and p-type ohmic contacts as well as metal gates.
  • Electron beam evaporators of both metals and insulators.
  • Wet etching using a range of different chemicals.
  • Reactive ion etching.
  • Plasma enhanced chemical vapour deposition (PECVD) of silicon nitride and silicon oxides.
  • Wire bonding and electrical testing of devices.
  • Atomic force microscope and Dektak for process characterization.
  • The facility has around 40 regular users including users from other institutions.
A processed wafer
Surface acoustic wave device for quantum processing